Semiconductor packaging technology - List of Manufacturers, Suppliers, Companies and Products

3D semiconductor packaging technology

From two dimensions to three dimensions: 3D packaging technology that greatly influences the performance of semiconductors.

◇Three-Dimensional Implementation Technology that Breaks Through the Limits of Miniaturization Chapter 1: Outlook and Challenges of Three-Dimensional Stacking Technology Chapter 2: Design Technology Chapter 3: TSV (Through-Silicon Via) Chapter 4: Bonding Technology Chapter 5: Interposer Chapter 6: Applications Chapter 7: Related Materials Chapter 8: Reliability

Company：エヌ・ティー・エス
Price：10,000 yen-100,000 yen

Technical and Reference Books
Semiconductor packaging technology

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COB high-density implementation problem solving

Leave the implementation challenges to us! We will propose solutions with our unique design and know-how.

We propose unique design and implementation know-how using the technology accumulated through various achievements, covering package structure, bonding methods, and material selection. With our technical expertise and know-how in bonding methods for semiconductor bare chips, measurement, inspection, and reliability evaluation, we support our customers in solving their challenges. 【Challenges → Solutions】 ■ Want to implement without voids → Design and create dedicated FC fixtures ■ Want to use FC but can only obtain chips individually → Form bumps on individual pieces using a bump bonder ■ Implementing at an overseas factory but yield is not improving → Reassess conditions within our company. Reproduce NG and point out areas for review. *For more details, please refer to the PDF document or feel free to contact us.

Company：イデアシステム
Price：Other

Circuit board design and manufacturing
Other mounting machines
Semiconductor packaging technology

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"MONSTER PAC" semiconductor packaging technology that achieves low temperature and high precision.

Low-temperature bonding from 80℃ unlocks the potential of heat-sensitive devices.

We have achieved high-precision mounting on thermally fragile chips and film substrates, which was impossible with conventional solder mounting. Standard solder joints require high temperatures of 260°C, but MONSTER PAC enables low-temperature bonding at 80°C to 170°C using conductive paste. This suppresses thermal expansion of materials and allows for narrow pitches of less than 40μm and high-precision mounting of less than 3μm. It is a suitable method for mounting advanced devices sensitive to heat, such as magnetic sensors and MEMS. *You can download the technical details and specifications of MONSTER PAC from here.*

Company：コネクテックジャパン
Price：Other

Contract manufacturing
Semiconductor packaging technology

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Semiconductor packaging technology - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Semiconductor packaging technology Product List

3D semiconductor packaging technology

COB high-density implementation problem solving

"MONSTER PAC" semiconductor packaging technology that achieves low temperature and high precision.

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